LED packaging form divide of separation and integration。LED separation device belongs to the traditional form of packaging, widely used in various related fields, after nearly forty years of development, has formed a series of mainstream product form. The LED COB module  belongs to the personalized packaging forms, mainly for the application of some cases and personalized product design and production, has not formed the mainstream form ofproducts.Semiconductor lighting to enter the general lighting field, the cost of production is the first major constraints. To reduce the cost of semiconductor lighting, we must first consider how to reduce the cost of the LED package. The traditional approach is LED lighting: LED light source module separation devices → MCPCB lighting module→ LED lamps, mainly based on the core source components do not apply and the approach is not only time-consuming work, and high costs. In fact, we can be “LED light source module separation devices → MCPCB lighting module” combined the MCPCB lighting module and LED chips together to make COB light source module direct, take the “COB light source module → LED lamps” route, not only can save time, but it will save the cost of the device package. The cost, compared with the separation light source device, COB light source module can save device packaging costs in lighting product applications。light engine module production cost and the secondary light distribution costs.In the same function lighting system, the overall cost can be reduced about 30%, which is for the promotion of semiconductor lighting applications has great significance. In performance, through rational design and molding microlenses, COB light source module can be effectively avoided discrete light source device present in combination in the light, glare and other disadvantages, but also by adding an appropriate red-chip combination, without reducing the light efficiency and life under the premise of effectively improving the color of the light source (now can do 90 or more).