The high power white LED lighting the way with Integrated multi-chip LED package. his article summarizes the integrated package of features,With the wide application of high-power white LED lighting in the field,integrated package will be development. with great speedLED light source compared to traditional light sources with high luminous efficiency, long life, energy saving, short response time, safe and reliable, making it from the invention has been people’s attention. In recent years, LED lighting has been more widely used, was considered a major development in the direction of the lighting market, there is great potential. As people on the global energy shortage concerns intensified, the prospect of LED high-profile. States have developed their own LED lighting development plan now,Currently, there are two ways to achieve high-power LED lighting: First pack the single powerful LED chip; Second, the use of multi-chip integrated package. For the former, with the development of chip technology, the size increases, improving quality, high power LED can be driven by a large current, but will be limited chip size; latter has greater flexibility and potential to development, illumination can be changed depending on the number of chips, meanwhile it has a high qualities, making the LED integrated package to become one of the main direction of the LED light source package.Integrated package, also known as multi-chip packaging,according to the required power to determines the number of substrate on the base of LED chip, can be combined into 1W, 2W, 3W and other high brightness LED light source with high power, according to the optical design of the chip used in the shape of a high refractive index material.and finally, the use of high refractive index material according to the shape of the optical design of the chip package. Its unique packaging concept determines that it has many advantages, such as: chip can be designed as a series or parallel, the flexibility to adapt to different voltage and current, design is easy to drive, to improve the luminous efficiency and reliability;
1、 chip in series or in parallel can be designed to flexibly adapt to different voltage and current, to facilitate the design of the drive and improve the efficiency and reliability of the light source; 2、The a number of chip can be controlled freely arccording to the customer’s requirements in certain area. can be encapsulated into a point light sources or face various forms;3、the chip can connected with the substrate directly,and reducing the package thermal resistance, heat problem tractable.Refer to the above for that information. Get a summary review.The current mainstream form of multi-chip package is integrated between multiple chips directly to a series-parallel connected to the substrate,and the chip is encapsulated in the independent packageProcess is simple, streamlined packaging materials, meanwhile reducing the thermal resistance, improved light efficiency, in addition to ease of assembly into LED lighting products, COB modular LED packaging technology has many advantages. (relative to the same power single chip package model )

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