LED solution LED heat dissipation— aluminum substrate design choice of LED circuit design, in order to better solve the problem of heat dissipation, LED and some high power IC needs to use the aluminum base circuit board.Aluminum substrate is composed of PCB circuit layer (Tong Boceng), heat insulating layer and the metal base layer. Circuit layer requirements with current carrying capacity greatly, thus should use thick copper foil, thickness of 35 um~280 um; thermal insulation layer is PCB aluminum substrate of core technology, it is generally composed of special, polymer filled by special ceramic thermal resistance is small, the viscoelastic performance is excellent, has the ability of anti aging to withstand mechanical and thermal stress of IMS-H01 IMS-H02 and LED-0601 PCB high performance aluminum,The heat insulating layer and substrate is the use of this technique makes it has very good thermal conductivity and high strength electrical insulation properties; metal base is a support member aluminum substrate, is required to have high thermal conductivity, the general is aluminum plate, also can use of copper (the copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting and conventional machining. The process requirements are: gold plating, tin spraying, OSP oxidation, lead-free ROHS process etc.. Material: aluminum substrate product features: The insulation layer is thin, small thermal resistance; non-magnetic; good heat dissipation; high standard thickness of mechanical strength product: 0.8, 1, 1.2, 1.5, 2, 2.5 copper foil thickness: , 3.0mm 1.8um 35um 70UM 105um 140um features: with high heat dissipation, electromagnetic shielding performance, high mechanical strength, excellent processing properties. Usage: LED special power hybrid IC (HIC). Aluminum substrate is carrying LED and device of heat conduction, heat dissipation is mainly dependent on the area, concentrated heat conduction can choose to board with high thermal conductivity, such as the United States Beggs sheet; slow heat conduction or heat domestic material can be. The price is difference , Beggs sheet to produce the finished product probably need 4000 / square meters, general domestic materials 1000 /square meters. LED lamp general use voltage is not very high, the choice of 1mil thickness of insulation layer can withstand voltage greater than 2000V. Radiation reference design methods: why thermal design? The effects of high temperature on electronic products: insulation performance degradation; damage to components; aging materials heat; low melting point weld cracking, the welding points off. Effect of temperature on components: generally, temperature resistance is reduced; the high temperature will reduce the service life of the capacitor; decline in the performance of high temperature will make the transformer, choke coil insulation material, general transformer, choke coil allows the temperature lower than 95C; the temperature is too high。